Elon Musk, the visionary behind Tesla, has recently announced plans to build a gigantic chip fabrication plant to meet the ...

Opening marks a milestone for high-volume manufacturing of 3D advanced packaging technologies. RIO RANCHO, N.M.--(BUSINESS WIRE)--What’s New: Today, Intel celebrated the opening of Fab 9, its ...

Old Price Road cuts a stark divide through the Arizona desert on its nearly straight north-south run. West, green fields give way to beige sand. Beyond, the Sierra Estrella mountains dominate the ...

Prior to becoming the CEO of VMWare in 2012, Pat Gelsinger was a long-time Intel employee dating back to the Andy Grove era and Chief Technology Officer under Craig Barrett and Paul Otellini. It’s ...

Intel today unveiled its most advanced semiconductor process and previewed Xeon 6+ (code-named Clearwater Forest), its first Intel 18A-based 2nm data center server chip, expected to launch in the ...

Intel joins hands with Taiwanese fab United Microelectronics Corp. (UMC) in a new twist in the continuously evolving and realigning semiconductor foundry business. What does Intel’s strategic ...

Intel Corp. executives today detailed a new business vision for its foundry unit, freshly renamed Intel Foundry, and revealed the most advanced chip manufacturing process on the company’s technology ...

Intel’s Fab 34 production milestone is another proof point that Intel is executing on its plan to deliver five process nodes in four years and to usher in a new generation of leadership products.

Intel announced today that it would delay opening its Fab 42 in Arizona, with no word for when it would finish upgrading the facility and ramp up its production. Intel spokesperson Chuck Malloy ...

Fab 34 is designed to support high-volume production of Intel 3 and Intel 4 technologies. In addition to Fab 34, Intel maintains a second manufacturing facility in Leixlip, Fab 24, which has been a ...

Opening marks a milestone for high-volume manufacturing of 3D advanced packaging technologies. Fab 9 will help fuel the next era of Intel’s innovation in advanced packaging technologies. As the ...