The electrochemical deposition (ECD) equipment market for IC packaging is heating up as 2.5D, 3D and fan-out technologies begin to ramp. Applied Materials recently rolled out an ECD system for IC ...
Momentum is building for IC packages based on an emerging technology called molded interconnect substrate (MIS). ASE, Carsem, JCET/STATS ChipPAC, Unisem and others are developing IC packages based on ...
Manz AG, a global high-tech engineering company with a comprehensive technology portfolio, showcases its high-density packaging production solutions at the SEMICON Southeast Asia 2023 on May 23-25 in ...
IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...
Johnstech International has announced the release of its new Low-Force XL contacts for Pad ROL100A Series and Pad ROL200 Series test contactors for testing NiPdAu IC packages. The new contactors offer ...
Targeting a silicon device for a flip-chip package introduces significant IC and package design complexities throughout the entire product development cycle. This package-die combination must be ...
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