A thermal expansion coefficient is a well-established key principle that all solid materials have different properties when exposed to variations in temperature. When they are exposed to high ...

This article discusses bonding of substrates with different coefficients of thermal expansion (CTE) which is difficult in adhesive applications such as bonding aluminum to glass, glass to plastics, ...

Master Bond EP42HT-2LTE is an innovative, two component epoxy system with an ultra low coefficient of thermal expansion. It can be used as an adhesive, sealant, coating and, in some cases, as a ...

Advances in the development of high power and high performance electronic devices demand innovative approaches for heat transfer materials. While it is given that thermal performance must be maximized ...

This paper analyzes the efficiency of silicon MOSFETs in surface-mount (SMD) packages with top-side cooling compared to bottom-side cooling packages in terms of thermal performance, lowering both ...