Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically ...
A new single-string method lets flat designs deploy into complex 3D structures, with potential uses in modular space habitats ...
Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.
Thermal Modeling in Emerging Heterogeneous 2.5D/3D Systems (EPFL, Universidad Complutense de Madrid)
Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet systems” was published by researchers at EPFL and ...
Stanford, CMU, Penn, MIT, and SkyWater Technology reached a major milestone by producing the first monolithic 3D chip ...
As the number of skilled tradespeople dwindles in the United States, Walmart is trying to build up its own workforce to keep ...
Abstract: Sea ice forecasting remains a challenging topic due to the complexity of understanding its driving forces and modeling its dynamics. This article contributes to the expanding literature by ...
Abstract: The waste management organisations face significant challenges in effectively identifying and classifying waste materials. As of 2023, the world generates approximately 2.1 billion tonnes of ...
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