Science Daily

This new 3D chip could break AI’s biggest bottleneck

Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically ...
Tech Xplore

One pull of a string is all it takes to deploy these complex structures

MIT researchers have developed a new method for designing 3D structures that can be transformed from a flat configuration ...
IEEE

HyDA-Net: A Hybrid Dense Attention Network for Remote Sensing Multi-Image Super-Resolution

Abstract: Remote sensing imagery super-resolution (SR) has gained focus due to its importance in enhancing satellite images to aid in the study of Earth. Recently, deep learning has advanced ...
Hackaday

Origami On Another Level With 3D Printing

Origami has become known as a miracle technique for designers. Elegant compliant mechanisms can leverage the material ...

This New 3D Chip Could Shatter the “Memory Wall” Holding Back AI

Stanford, CMU, Penn, MIT, and SkyWater Technology reached a major milestone by producing the first monolithic 3D chip ...
IEEE

Zero Watermark to Protect 3D Models Based on the Mean Normal Vectors of Polygons

Abstract: This paper discusses a method of protecting rights to digital 3D models using zero-watermarking technology. The method involves the calculation of a vector descriptor of the model based on ...
C&EN

Multifunctional 3D Printing of Heterogeneous Polymer Structures by Laser-Scanning Micro-Stereolithography Using Reversible Addition–Fragmentation Chain-Transfer Polymerization

Faculty of Engineering, Yokohama National University, 79-5 Tokiwadai, Hodogaya-ku, Yokohama 240-8501, Japan ...