Analytical technique provides new insight into old DNA samples

Research institutions around the world house valuable genetic information that could help unlock countless medical mysteries.
IEEE

Thermal–Mechanical Performance Analysis and Structure Optimization of the TSV in 3-D IC

Abstract: The through-silicon via (TSV) technology is widely used in 3-D integrated circuit (3-D IC) devices. However, the TSV could cause great thermal stress due to the mismatch of the thermal ...