Research institutions around the world house valuable genetic information that could help unlock countless medical mysteries.

Abstract: The through-silicon via (TSV) technology is widely used in 3-D integrated circuit (3-D IC) devices. However, the TSV could cause great thermal stress due to the mismatch of the thermal ...

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Can you chip in? This year we’ve reached an extraordinary milestone: 1 trillion web pages preserved on the Wayback Machine. This makes us the largest public repository of internet history ever ...

Abstract: The three-dimensional (3-D) finite element (FE) analysis is an extremely time-consuming task in the design and optimization of axial flux permanent magnet (AFPM) machines. The aim of this ...

School of Food and Biological Engineering, College of Bioresources Chemical and Materials Engineering, Shaanxi University of Science and Technology, Xi’an 710021, P. R. China ...