Taking place at the end of the semiconductor process flow, dicing is the process where the silicon wafer is finally turned into individual chips, or die, traditionally by means of a saw or laser. A ...

IT professionals will be able to top up their skills, as Kaspersky has added its new ‘Reverse Engineering 101’ course to its ever-growing xTraining’s portfolio. It offers comprehensive knowledge, ...

Sometimes, even the soundest engineering isn’t sound-enough engineering. So when things go sideways, politics can be a shrewd tool or your undoing. So there you are, with your bare face hanging out, ...