Hysol GR9810 epoxy molding compound is designed for use as an overmold on a variety of laminate-based molded array packages including SIP and flip-chip array packages that have been conventionally ...
Abstract: Epoxy mold compound curing behavior is a fundamental material property which affects the molding process and molded package performance. This paper aims to understand the effect of different ...
Abstract: Solid insulation technology in medium voltage 12kV switchgear has been widely used. In order to realize further miniaturization, weatherability, security, metallization treatment on ...
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