Abstract: Interposer-based 2.5D integrated circuits (ICs) are seen today as a precursor to 3D ICs based on through-silicon vias (TSVs). All the dies and the interposer in a 2.5D IC must be adequately ...
Abstract: The demand for high-performance semiconductor products in line with the development of information technology industry continues to increase. However, fab node shrinkage, which led the ...
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