Packaging innovation has always been critical to the cooling of components, especially for power-switching devices such as MOSFETs and IGBTs. The non-stop demand to make these devices smaller and ...
Housed in a tiny surface-mount package, the ES series of RF modules uses an advanced FM/FSK-based synthesized architecture to achieve, among other things, high noise immunity compared to AM/OOK ...
Radiation-tolerant, high-current-density DC-DC converter modules supply power to the AI1 transponder for innovative computing ...
This could be built by assembly of different silicon technologies at wafer Level, allowing the dense co-integration of ...
Nordic Semiconductor has launched a development kit designed for RF engineers to develop cellular internet of things (IoT), ...
With the exception of the iPhone, Apple's products largely lack technology to provide ubiquitous access to the outside world while on the go. However, a new proposal from the company would attempt to ...
TE Connectivity’s high-frequency nanominiature contact doubles density, reduces packaging. TE Connectivity, a connectivity and sensors company, has released new NanoRF modules and contacts, which ...
The scope of this application note is about the PRF-1150 1kW, 13.56 MHz, Class E RF generator evaluation module. The application note introduces the evaluation module, its theory of operation, ...
If you want to mess around with your Xbox 360 controllers on a computer Microsoft would be happy to sell you a USB dongle to do so. But [Tino] went a different route. The board that drives the Xbox ...
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