MILPITAS, CA – Worldwide silicon wafer shipments rose 3.1% year-on-year in the third quarter to 3,313 million square inches (MSI), according to the SEMI Silicon Manufacturers Group. The increase ...

Krailling, Germany – November 5th, 2025 – Photonics Systems Group (PSG), a leading expert in laser micromachining specifically for the electronics industry, today announced its inaugural after-hours ...

Protecting design IP. Broadly speaking, the data in a design include the following categories. The design data in an ECAD/PCB ...

True 3-D interconnects and packaging. Rigid PCBs are inherently 2-D. Rigid-flex, however, allows you to fold, bend and twist ...

FRANCE – The EIPC (European Institute for the PCB Community) is seeking abstracts for technical presentations at its Winter Conference, taking place February 3–4, 2026, in Aix-en-Provence, France.

Austin, Texas, November 4th 2025 – High Density Packaging User Group (HDP) is pleased to announce that the European Space Agency (ESA) has become a member.

Austin, Texas, November 3, 2025 – High Density Packaging User Group (HDP) is pleased to announce that the Aoshikang Technology (Hong Kong) Co., Ltd (ASKPCB) has become a member.