News

Semiconductor Engineering2h

Overview: Ultra Ethernet’s Design and Architectural Advancements (ETH Zurich, Broadcom, HPE et al.)

A new technical paper titled “Ultra Ethernet’s Design Principles and Architectural Innovations” was published by researchers ...
Semiconductor Engineering2h

Wire-Friendly Domain-Specific Processor for Angstrom-Era Nodes with High Core Density (Politecnico di Torino, imec et al.)

A new technical paper titled “Physical Design Exploration of a Wire-Friendly Domain-Specific Processor for Angstrom-Era Nodes ...
Semiconductor Engineering2h

Best Options For Using AI In Chip Design

Narrowly defined verticals offer the best opportunities for AI. Plus, what will the impact be on junior engineers?
Semiconductor Engineering17h

Scheduling Architecture Integrated With M3D BEOL Memories For LLM Inference (Georgia Tech, Samsung)

A new technical paper titled “Architecting Long-Context LLM Acceleration with Packing-Prefetch Scheduler and Ultra-Large ...