CEA-Leti has announced a three-year programme aimed at speeding up high-performance computing for AI through microLED-based ...

AMD has said it supplies components to four of the world’s 10 fastest supercomputers, as it outlined its expanding role in HPC and AI.

As COP30, the United Nations climate conference, is almost over, global attention is now centred on fossil-fuel phase-out ...

The Institution of Engineering and Technology (IET) is urging the Government to deliver a Budget that secures Britain’s ...

Toshiba Electronics Europe GmbH announces commercial sample shipments of its innovative gate driver IC, the TB9084FTG.

CoAsia Semi has struck a manufacturing deal with Inova Semiconductors to produce ISELED automotive lighting chips.

The Open University has developed a wireless control designed specifically for dogs to switch household appliances on and off ...

The University of Liverpool's ambitious plan to position the Liverpool City Region and the UK as leaders in AI-driven ...

The Fraunhofer Institute for Electronic Nano Systems ENAS and X-FAB are joining forces in an innovative cooperation model ...

As AI workloads push thermal limits in data centres higher, Stäubli is leading a new phase of standardisation in ...

Rohde & Schwarz has further deepened its collaboration with Broadcom to enable testing and validation of Wi-Fi 8 chipsets ...

congatec announced a technology collaboration with Qualcomm Technologies that will speed the commercialisation of ...