Continuous upgrades in memory technology have created a structural imbalance in supply and demand. Nevertheless, memory supplier Winbond Electronics delivered strong earnings in the third quarter of ...

Let’s not sugarcoat Double Dragon Revive‘s biggest flaw however, it should never have had 3D characters and full eight way movement for a multitude of reasons. The first of these reasons is felt right ...

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Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a significant shift in system integration strategies. Industry analyses show 3D IC ...

InPsytech, a leading company under the Egis Technology Group specializing in high-speed semiconductor IP solutions, has completed its advanced design for TSMC's Face-to-Face (F2F) SoIC technology, ...

A directive issued by the U.S. Department of Commerce’s Bureau of Industry and Security (BIS) to stymie sales of EDA (electronic design automation) tools directly to China was destined to be a talking ...

Automotive wiring harnesses consolidate multiple wires and cables into a single organized system, transmitting power and signals between electronic control units (ECUs). These harnesses connect ...

Despite their strength and versatility, design rights remain underused. As Wässingbo notes, “Maybe one can say that design is often in the shadow of patents, utility patents, and trademarks.” Indeed, ...

Abstract: Discrete time-variant equation systems represent a typical and complex problem across various disciplines. With the increasing complexity of systems in various fields, traditional methods ...