Abstract: As chiplets containing multiple diverse functional dies are integrated into a single package, the demand for advanced packages with higher density interconnects and larger footprint body ...
Abstract: Developing high-temperature and high-voltage SiC power modules requires packaging insulation with better thermal stability and electrical properties at high temperatures. This work studied ...
Beauty packaging in 2026 is expected to reflect a growing desire for comfort and authenticity in the face of volatility and the rising influence of artificial intelligence. For this article, Cosmetics ...
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