A new technical paper titled “Ultra Ethernet’s Design Principles and Architectural Innovations” was published by researchers ...

Time-of-flight sensors; manufacturing quantum chips; collaboration for growth; wafer shipment conundrum; sparse linear ...

A new technical paper titled “Physical Design Exploration of a Wire-Friendly Domain-Specific Processor for Angstrom-Era Nodes ...

Narrowly defined verticals offer the best opportunities for AI. Plus, what will the impact be on junior engineers?